MEMS or the Microelectromechanical Systems is a technology that is important to the semiconductor industry; it is designed for very small devices as it is made up of components that are between 1 and 100 micrometers in size. It has a lot of uses particularly in electronics, biotechnology, as well as in communication industry.
MEMS production/fabrication is carried out by a number of different processes, which include deposition, pattering, and etching. However, in this content, we are to focus on the etching processes for MEMS.
When it comes to MEMS etching, it can be done using several processes, and they can be divided into two broad categories - the wet and dry etching.
Dry etching - in this process, the material is dissolved using reactive ions or a vapor phase enchant. One advantage of this method is capable of defining small feature size that is less 100 nm). But it has a number of limitations as well such as high cost, low throughput, poor selectivity, hard to implement, and the potential for radiation damage.
Sample of dry etching
Xenon fluoride etching - this dry vapor phase isotropic etch process was first utilized in 1995; it is mainly for the purpose of releasing metal and dielectric structures by undercutting silicon.
Plasma etching - this process includes the generation of reactive species, diffusion of these species, and then adsorption. (note: plasma source is also called etch species)
Wet etching - the material is dissolved through immersion in a chemical solution inside a wet bench. It has a number of advantages, including: low cost, easy to implement, high etching rate, and good selectivity for most materials. However, it has several disadvantages as well such as the inadequacy for defining feature size that is less 1 micrometer.
Sample of wet etching
Isotropic etching - it is a process known as the non-directional removal of material from a substrate, which is done in a chemical process using substance/mixture called as etchant.
Hydrofluoric acid etching - a process that uses an aqueous etchant for silicon dioxide.
There are quite a number of processes involved in etching - each has its own advantages and limitations. One thing is clear, however - etching plays a vital role in micro fabrication, which is essential to the production of devices needed in the industry.
MEMS production/fabrication is carried out by a number of different processes, which include deposition, pattering, and etching. However, in this content, we are to focus on the etching processes for MEMS.
When it comes to MEMS etching, it can be done using several processes, and they can be divided into two broad categories - the wet and dry etching.
Dry etching - in this process, the material is dissolved using reactive ions or a vapor phase enchant. One advantage of this method is capable of defining small feature size that is less 100 nm). But it has a number of limitations as well such as high cost, low throughput, poor selectivity, hard to implement, and the potential for radiation damage.
Sample of dry etching
Xenon fluoride etching - this dry vapor phase isotropic etch process was first utilized in 1995; it is mainly for the purpose of releasing metal and dielectric structures by undercutting silicon.
Plasma etching - this process includes the generation of reactive species, diffusion of these species, and then adsorption. (note: plasma source is also called etch species)
Wet etching - the material is dissolved through immersion in a chemical solution inside a wet bench. It has a number of advantages, including: low cost, easy to implement, high etching rate, and good selectivity for most materials. However, it has several disadvantages as well such as the inadequacy for defining feature size that is less 1 micrometer.
Sample of wet etching
Isotropic etching - it is a process known as the non-directional removal of material from a substrate, which is done in a chemical process using substance/mixture called as etchant.
Hydrofluoric acid etching - a process that uses an aqueous etchant for silicon dioxide.
There are quite a number of processes involved in etching - each has its own advantages and limitations. One thing is clear, however - etching plays a vital role in micro fabrication, which is essential to the production of devices needed in the industry.
About the Author:
Paul Drake has had several years of experience working in a high tech facility before venturing online as a content writer. He uses his prior knowledge in writing industry-related topics, including etching process for MEMS. He also manages a personal blog of the same niche.
Comments :
0 comments to “Etching Processes For MEMS”
Post a Comment